At the India Mobile Congress, Oppo and MediaTek confirmed that the forthcoming Find X9 series will be the inaugural smartphone lineup to incorporate the newly-announced MediaTek Dimensity 9500 System-on-Chip (SoC). This announcement, while previously anticipated, solidifies the integration of the advanced chipset.
A key development stemming from this announcement is the projected launch of the Find X9 series in India during November. This timeline follows an initial announcement scheduled for October 16th in China. This suggests a potential global premiere preceding the Indian launch.
The Dimensity 9500 SoC is engineered to deliver significant performance and efficiency enhancements. The architecture utilizes a third-generation All-Big-Core design, with the primary core operating at 4.21 GHz. MediaTek projects a 17% increase in CPU performance, coupled with a 55% reduction in peak power consumption compared to the previous generation. Furthermore, the integrated ARM G1-Ultra GPU is expected to provide a 33% performance increase while consuming 42% less power.
Oppo has stated that the Find X9 series will incorporate an advanced cooling solution to mitigate thermal constraints. This specialized cooling mechanism is designed to maintain sustained high performance under intensive workloads, ensuring optimal user experience.
