REDMAGIC Unveils Advanced Liquid Cooling Technology for Smartphones at Shenzhen Conference
REDMAGIC showcased its latest advancements in smartphone cooling technology at the REDMAGIC Gaming and Liquid Cooling Technology Conference in Shenzhen. The focal point of the event was the introduction of the industry’s first mass-produced liquid cooling system integrated with advanced air-cooling innovations. Detailed information is available on the company’s official website.
This liquid cooling system mirrors the architecture found in high-performance gaming PCs and AI servers, employing a pump to circulate coolant over heat-generating components. The heated liquid is then channeled towards a fan and radiator assembly for heat dissipation.
Distinguishing itself from passive vapor chamber cooling, the REDMAGIC system employs an active liquid cooling solution designed to manage significantly higher thermal loads. The miniaturization of components was a primary focus in adapting the technology for smartphone integration. REDMAGIC engineers developed a piezoelectric ceramic micropump, the core of the system, after numerous design iterations to balance fluid circulation efficiency and size constraints.
Precision manufacturing techniques, including micron-level laser cutting, were utilized to create the liquid transport channels. These channels facilitate coolant flow between the pump and fan, optimized for low-resistance performance. The coolant itself is a fluorinated liquid, exhibiting operational effectiveness across a temperature range of -40°C to 70°C (-40°F to 158°F). This coolant, commonly utilized in AI servers, provides excellent electrical insulation and thermal transfer characteristics.
Addressing the challenges of device durability in mobile environments, REDMAGIC implemented an ultra-low-temperature bonding process and new anti-puncture membranes. These measures were implemented to ensure the device’s resilience, validated through extensive drop testing.
The forthcoming REDMAGIC 11 Pro series will incorporate this new liquid cooling system. Powered by the Snapdragon 8 Elite Gen 5 processor, the series features a dual-track cooling system, enhancing sustained high-performance gaming capabilities.
The 11 Pro series is engineered to support consistent 90fps gameplay in Wuthering Waves at ultra-high graphics settings for up to 120 minutes. Furthermore, the devices are optimized for over 200 popular titles, rendering at 2K resolution and 144Hz frame rates, facilitating a marked improvement in visual fidelity and gameplay smoothness.
The new models will also integrate the Turbo Fan 4.0 system, combining independent, channel-based, and composite air-cooling methods. This system includes an active cooling fan, capable of spinning at up to 24,000 rpm. This fan is complemented by a large airflow duct and a dual-track heat dissipation system incorporating a 4D vapor chamber heat sink, enhancing thermal management across the device.
The Turbo Fan 4.0 system is also the first smartphone active cooling system to achieve an IPX8 rating for submersion resistance.
REDMAGIC esports phones have been selected as the official devices for six major esports leagues in China, including the CrossFire Mobile Pro League, Arena Breakout Pioneer Cup, QQ Speed Mobile S League, Call of Duty Mobile Masters, League of Legends Mobile Super League, and Dawn Heroes Team Tournament, demonstrating the reliability of the devices. According to Chen Jin, head of Tencent’s K1 CrossFire product operations, REDMAGIC devices “reduce abnormal exits, mid-match disconnects, and spare device usage, meeting the stringent demands of professional tournaments.”
The REDMAGIC 11 Pro series is poised to elevate smartphone gaming performance and set new standards for sustained high performance.
Further information is available at redmagic.gg.
